4,4'-(9-Fluorenylidene)diphenol, CAS No. 3236-71-3

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3236-71-3

Catalog No. EBD49502

CAS 3236-71-3

Name 4,4'-(9-Fluorenylidene)diphenol

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Basic Information

Synonyms: 9,9-Bis(4-hydroxyphenyl)fluorene 4,4'-(9-Fluorenylidene)diphenol fluorene-9-bisphenol 4,4-(9-Fluorenylidene)diphenol 9,9-Bis(Hydroxyphenyl)Fluorene bisphenolfluorene 9,9'-bis(4-hydroxyphenyl)fluorene 4,4'-(9H-fluorene-9,9-diyl)diphenol fluorene-9-biphenol BPF Fluornen-9-bisphenol 4,4'-(9-Fluoroenylidene)Diphenol

Molecular Formula: C25H18O2

Molecular Weight: 350.41

MDL Number: MFCD00191392

Categories: Materials Chemistry > Optoelectronic and Organic Semiconductor Materials > OLED and Organic Optoelectronic Precursors Materials Chemistry > Polymers and Macromolecular Materials > Epoxy and Epoxy Resin Precursors

Product Description:

9,9-Bis(4-hydroxyphenyl)fluorene, commonly known as bisphenol fluorene (BPF), is a high-performance aromatic diol monomer. Its structure features a rigid, planar fluorene core symmetrically substituted with two phenolic hydroxyl groups. This configuration imparts high thermal stability, excellent optical transparency, and a high refractive index. The primary application of BPF is as a key building block in the synthesis of advanced polymers and functional materials. It is extensively used to produce high-performance polycarbonates, epoxy resins, and polyesters, which are valued for their high heat resistance, low birefringence, and good mechanical properties. These materials are critical components in optical lenses, LED encapsulants, and electronic packaging. Furthermore, its rigid, conjugated structure makes it a valuable precursor for organic light-emitting diode (OLED) materials and other organic electronic applications, where it contributes to charge transport and luminescent properties. BPF-based polymers are also explored for use in gas separation membranes and as photoresist materials in microelectronics due to their excellent chemical and thermal stability. As a specialty monomer, it enables the development of materials with tailored properties for demanding high-tech industries.

Physical Properties

Melting Point: 224-226 °C(lit.)

Boiling Point: 526.4 °C at 760 mmHg

Flash Point: 241 °C

Density: 1.288 g/cm3

Safety Information

Packing Level: III

Hazard Category: 9

Transport Codes: 3077