ethenyl-(ethenyl-methyl-phenylsilyl)oxy-methyl-phenylsilane, CAS No. 2627-97-6

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2627-97-6

Catalog No. EBD105904

CAS 2627-97-6

Name ethenyl-(ethenyl-methyl-phenylsilyl)oxy-methyl-phenylsilane

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Basic Information

Synonyms: 1,3-Divinyl-1,3-diphenyl-1,3-dimethyldisilo 1,3-diethenyl-1,3-dimethyl-1,3-diphenyldisiloxane methyl-(methyl-phenyl-vinyl-silyl)oxy-phenyl-vinyl-silane ethenyl-(ethenyl-methyl-phenylsilyl)oxy-methyl-phenylsilane 1,3-diethenyl-1,3-dimethyl-1,3-diphenyl-disiloxan 1,3-diethenyl-1,3-dimethyl-1,3-diphenyl-disiloxane 1,3-dimethyl-1,3-diphenyl-1,3-divinyl-disiloxane disiloxane,1,3-diethenyl-1,3-dimethyl-1,3-diphenyl- 1,3-divinyl-1,3-diphenyl-1,3-dimethyldisiloxane disiloxane,1,3-dimethyl-1,3-diphenyl-1,3-divinyl- 1,3-divinyl-1,3-diphenyl-1,3-dimethyldisiloxane97%

Molecular Formula: C18H22OSi2

Molecular Weight: 310.54

Categories: Materials Chemistry > Polymers and Macromolecular Materials > Functional Copolymer Monomers Materials Chemistry > Surface Modification and Functional Coatings > Silanes and Alkoxysilanes

Product Description:

1,3-Divinyl-1,3-dimethyl-1,3-diphenyldisiloxane is a symmetrical organosilicon compound featuring two vinyl groups and two phenyl groups attached to a disiloxane backbone. It serves as a versatile crosslinking agent and monomer in polymer chemistry. Its primary application is in the synthesis and modification of silicone-based polymers and materials. The vinyl groups readily undergo hydrosilylation reactions with Si-H containing siloxanes, enabling the formation of crosslinked networks. This property is crucial for producing high-performance silicone resins, elastomers, and coatings with enhanced thermal stability, mechanical strength, and specific surface properties. It is also used to introduce phenyl groups into silicone polymers, which can improve refractive index, radiation resistance, and thermal-oxidative stability. This compound finds use in the development of specialty materials for electronics (e.g., encapsulants, adhesives), optical devices, and as a precursor for surface modification agents to create hydrophobic or functionalized surfaces.

Physical Properties

Melting Point: <25 °C

Boiling Point: 318.9 °C at 760 mmHg

Flash Point: 122.9 °C

Density: 0.98 g/cm3