2-[(2-hydroxyphenyl)methyl]phenol, CAS No. 2467-02-9

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2467-02-9

Catalog No. EBD90431

CAS 2467-02-9

Name 2-[(2-hydroxyphenyl)methyl]phenol

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Basic Information

Synonyms: 2,2-methylenediphenol 2,2-Dihydroxydiphenylmethane bis(2-hydroxyphenyl)methane bis(o-hydroxyphenyl)methane 2,2'-methylenediphenol 2,2'-dihydroxydiphenylmethane 2,2’-bisphenolf 2,2’-methanediyl-di-phenol 2,2’-methylenebis-pheno 2,2’-methylenebis-phenol 2-[(2-hydroxyphenyl)methyl]phenol

Molecular Formula: C13H12O2

Molecular Weight: 200.23

MDL Number: MFCD00002243

Categories: Materials Chemistry > Polymers and Macromolecular Materials > Epoxy and Epoxy Resin Precursors Synthetic Chemistry > Organic Building Blocks > Phenols and Ethers

Product Description:

2,2'-Methylenebisphenol is an organic compound featuring two phenol rings linked by a methylene bridge. It serves as a crucial monomer and building block in polymer chemistry. Its primary industrial application is as a key intermediate in the synthesis of epoxy resins and phenolic resins. It reacts with epichlorohydrin to produce bisphenol F-type epoxy resins, which offer advantages such as lower viscosity and improved chemical resistance compared to the more common bisphenol A-based resins. These resins are widely used in high-performance coatings, adhesives, composites, and electrical laminates. Beyond its role in polymer synthesis, it is also utilized as a starting material or intermediate in organic synthesis, particularly in reactions involving phenolic compounds.

Physical Properties

Melting Point: 113-118 °C(lit.)

Boiling Point: 362.5 °C at 760 mmHg

Flash Point: 177.1 °C

Density: 1.208 g/cm3